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Outline
- Introduction Chapter 1: Introduction
- Semiconductors and semiconductor devices Chapter 4: Silicon
- Examples of crystal structures
- Miller indices W
- Intrinsic semiconductors
- Extrinsic semiconductors
- pn-junctions
- metal-semiconductor contacts
- Lithography Chapter 8: Pattern generation, Chapter 9: Optical lithography
- Pattern generation
- Electron beam lithography
- Optical lithography and EUV
- Photoresist
- Spin coating
- Spray coating
- Nanoimprint lithography
- Crystal and thin film growth Chapter 5: Thin film material and processes, Chapter 6: Epitaxy
- Purification of silicon
- Czochralski process
- Float Zone process
- Molecular beam epitaxy
- RHEED
- Chemical vapor deposition
- Semiconducting heterostructures
- Atomic layer deposition
- Laser ablation
- Thermal evaporation
- Sputtering
- Etching Chapter 11: Etching, Chapter 20: Anisotropic wet etching, Chapter 21: Deep Reactive Ion Etching, Chapter 16: Chemical–Mechanical Polishing
- Wet chemical etching
- Ion milling
- Reactive ion etching
- Chemical-Mechanical Polishing
- Cleaning Chapter 12: Cleaning
- Clean rooms, FOUPs
- Particle removal
- Organics removal
- Metals removal
- Oxide removal
- Doping Chapter 14: Diffusion, Chapter 15: Ion implantation
- Neutron transmutation
- Diffusion
- Ion implantation
- Oxidation Chapter 13: Thermal oxidation
- Dry oxidation
- Wet oxidation
- Deal-Groves Model
- CMOS Chapter 26: MOS fabrication, Chapter 28: Multilevel metallization
- MOSFETs
- Front end
- Wells
- Shallow trench isolation
- Self-aligned gates
- Contacts
- Back end>
- Metalization
- Passivation
- Packaging
- Memories
- DRAM
- SRAM
- Flash
- Phase change memory
- Micromechanics Chapter 29: Surface micromachining, Chapter 30: MEMs process integration
- Vibrations of beams and cantilevers
- Sacrificial layers
- Stiction
- Supercritical drying
- Accelerometers
- Gyroscopes
- Microphones
- Capacitive comb drives
- Rotary motors
- RF MEMs
- Micromirror displays
- Hinges, pop-up structures
- Wafer level optics
- Microfluidics
- Nozzles
- Bubble pumps
- Piezoelectric activated pumps
- Surface acoustic wave pumps
- Lab-on-a-chip
- Bottom-up technologies
- The end of miniaturization
- Self assembly
- Bio inspired materials
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