Decapsulation is the process of opening a packaged integrated circuit to see what is inside. Often the plastic encapsulation of integrate circuits is removed with strong acids. There is a commercial product called Dynasolve which is used for this purpose. There is a rosin method IC-Entkapselung_mit_Kolophonium that does not use such harsh acids. Another possibiity is to use an oxygen plasma. This is, however, a slow method.
Below is a description of some decapsulation projects.